Candidate will be required to successfully design and release complex RF PCB designs. RF EE willcomplete schematic capture and provide the schematic and RF transitions to PCB design for layout. Robust communication will be required between PCB designer, EE, ME Packaging, Thermal, Stress and Manufacturing personnel. Design deliverables will include Schematic, PCB, and Circuit Card Assembly drawings. • Demonstrated experience in PCB Design and Fabrication or Assembly. • Demonstrated experience working with external vendors as well as internal manufacturing. • Senior level experience with RF PCB design • Design experience using Siemens Xpedition and incorporation of design input from Ansys. • Knowledge of Design or Fabrication or Assembly specifications such as IPC 2221, 2222, 2223 or IPC 6012, 6013 or IPC 600. • Ability to review PCB and Assembly Drawings complicate with Drafting Standards, Geometric Tolerancing, and change management release packages. • Experience troubleshooting and resolving enterprise technical issues. • Proven understanding of electronics standards and processes. • Ability to communicate how and why a design meets specified requirements both in writing and verbally. • Demonstrated effective written & verbal communication.
Candidate will be required to successfully design and release complex RF PCB designs. RF EE willcomplete schematic capture and provide the schematic and RF transitions to PCB design for layout. Robust communication will be required between PCB designer, EE, ME Packaging, Thermal, Stress and Manufacturing personnel. Design deliverables will include Schematic, PCB, and Circuit Card Assembly drawings. • Demonstrated experience in PCB Design and Fabrication or Assembly. • Demonstrated experience working with external vendors as well as internal manufacturing. • Senior level experience with RF PCB design • Design experience using Siemens Xpedition and incorporation of design input from Ansys. • Knowledge of Design or Fabrication or Assembly specifications such as IPC 2221, 2222, 2223 or IPC 6012, 6013 or IPC 600. • Ability to review PCB and Assembly Drawings complicate with Drafting Standards, Geometric Tolerancing, and change management release packages. • Experience troubleshooting and resolving enterprise technical issues. • Proven understanding of electronics standards and processes. • Ability to communicate how and why a design meets specified requirements both in writing and verbally. • Demonstrated effective written & verbal communication.
