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Overview

Company
Booz Allen Hamilton
Location
all cities, NJ 32
Compensation
$61,900–$141,000/yr
Employment type
On-site
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  • Franchise Sales Executive (32)
  • Interview Day Coordinator (Part-Time)- Department of Enrollment Management Services/Admissions (32)
  • Moderators - Education and Early Years (32)
  • Territory Sales Director (Lead Science) (32)
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Booz Allen HamiltonVerified Employer

Business Services & Consulting • all cities, NJ 32

Microelectronics Advanced Packaging Engineer (32)

all cities, NJ 32On-sitePosted 16 hours ago
Business Services & Consulting

About the Role

Job Description

Remote Work:

No

Job Number:

R0242619

Location:

Beavercreek,OH,US

Share job via:

Share

Microelectronics Advanced Packaging Engineer
The Opportunity:

Apply engineering physics, engineering mathematics, and materials science principles to support the design, analysis, manufacture or maintenance of mechanical systems. Apply specific functional knowledge and working and general industry knowledge. Develop or contribute to solutions to a variety of problems of moderate scope and complexity. Work independently with some guidance and review or guide activities of junior employees.

You Have:
  • 2+ years of experience in dynamic manufacturing and R&D environment evaluating new packaging materials, processes, and architectures to align to state-of-the-art
  • Experience in eCAD and mCAD software
  • Experience with packaging, PCB fabrication, cleanroom processing, or SMT assembly
  • Experience developing packaging solutions that optimize Size Weight and Power (SWaP) and prototyping designs in a high-mix, low-volume R&D environment
  • Experience operating and maintaining complex equipment in microelectronics rapid prototyping laboratories
  • Experience with the complete packaging assembly processes from concept to prototype, including equipment and material selection for panel-level, wafer-level, and chip-level systems
  • Experience with flip-chip, BGA, WLP, system-in-package SiP, multi-chip modules MCM, panel level packaging, and heterogenous and chiplet integration
  • Ability to obtain a Secret clearance
  • Bachelor's degree in an Engineering field
Nice If You Have:
  • 5+ years of experience with advanced packaging technology innovation and prototyping
  • Experience collaborating with RF, digital, photonics, and analog designers to tailor packaging designs to application needs
  • Knowledge of trends related to current technology, including trends related to future technologies, design, or prototyping for DoD systems
  • Secret clearance
  • Master's degree in an Engineering field
Clearance:

Applicants selected will be subject to a security investigation and may need to meet eligibility requirements for access to classified information.

Compensation

At Booz Allen, we celebrate your contributions, provide you with opportunities and choices, and support your total well-being. Our offerings include health, life, disability, financial, and retirement benefits, as well as paid leave, professional development, tuition assistance, work-life programs, and dependent care. Our recognition awards program acknowledges employees for exceptional performance and superior demonstration of our values. Full-time and part-time employees working at least 20 hours a week on a regular basis are eligible to participate in Booz Allen's benefit programs. Individuals that do not meet the threshold are only eligible for select offerings, not inclusive of health benefits. We encourage you to learn more about our total benefits by visiting the Resource page on our Careers site and reviewing Our Employee Benefits page.

Salary at Booz Allen is determined by various factors, including but not limited to location, the individual's particular combination of education, knowledge, skills, competencies, and experience, as well as contract-specific affordability and organizational requirements. The projected compensation range for this position is $61,900.00 to $141,000.00 (annualized USD). The estimate displayed represents the typical salary range for this position and is just one component of Booz Allen's total compensation package for employees. This posting will close within 90 days from the Posting Date.

Identity Statement

As part of the hiring process, we will ask you to complete an identity verification process that leverages advanced biometrics and artificial intelligence to ensure authenticity and protect against identity fraud. You are expected to be on camera during interviews and assessments. We reserve the right to take your picture to verify your identity and prevent fraud.

Candidate AI Usage Policy

AI is a part of our daily work at Booz Allen, and we are committed to the responsible and ethical use of AI tools. However, we want to ensure a fair candidate process based on your own skills and knowledge. As part of this commitment, the use of artificial intelligence (AI) or other tools to assist with responses during interviews (whether in-person or virtual) is prohibited unless permission is explicitly provided.

Work Model
Our people-first culture prioritizes the benefits of collaboration, whether it occurs in person or virtually. To support engagement and effective communication, employees working virtually are generally expected to have their cameras on during meetings.
  • Remote: If this position is listed as remote, there may still be occasions when you are required to work in person at a Booz Allen or customer facility.
  • Hybrid: If this position is listed as hybrid, you will be expected to work from a Booz Allen facility frequently, in alignment with leadership expectations and the needs of the role. You may also be required to work from or visit a customer facility.
  • Onsite: If this position is listed as onsite, work will primarily be performed at a Booz Allen office or customer facility, where employees will collaborate directly with colleagues and customers as required by the role.


Commitment to Non-Discrimination

All qualified applicants will receive consideration for employment without regard to disability, status as a protected veteran or any other status protected by applicable federal, state, local, or international law.

Not ready to apply? Join our Talent Community and sign up for job alerts.
Job Description

Remote Work:

No

Job Number:

R0242619

Location:

Beavercreek,OH,US

Share job via:

Share

Microelectronics Advanced Packaging Engineer
The Opportunity:

Apply engineering physics, engineering mathematics, and materials science principles to support the design, analysis, manufacture or maintenance of mechanical systems. Apply specific functional knowledge and working and general industry knowledge. Develop or contribute to solutions to a variety of problems of moderate scope and complexity. Work independently with some guidance and review or guide activities of junior employees.

You Have:
  • 2+ years of experience in dynamic manufacturing and R&D environment evaluating new packaging materials, processes, and architectures to align to state-of-the-art
  • Experience in eCAD and mCAD software
  • Experience with packaging, PCB fabrication, cleanroom processing, or SMT assembly
  • Experience developing packaging solutions that optimize Size Weight and Power (SWaP) and prototyping designs in a high-mix, low-volume R&D environment
  • Experience operating and maintaining complex equipment in microelectronics rapid prototyping laboratories
  • Experience with the complete packaging assembly processes from concept to prototype, including equipment and material selection for panel-level, wafer-level, and chip-level systems
  • Experience with flip-chip, BGA, WLP, system-in-package SiP, multi-chip modules MCM, panel level packaging, and heterogenous and chiplet integration
  • Ability to obtain a Secret clearance
  • Bachelor's degree in an Engineering field
Nice If You Have:
  • 5+ years of experience with advanced packaging technology innovation and prototyping
  • Experience collaborating with RF, digital, photonics, and analog designers to tailor packaging designs to application needs
  • Knowledge of trends related to current technology, including trends related to future technologies, design, or prototyping for DoD systems
  • Secret clearance
  • Master's degree in an Engineering field
Clearance:

Applicants selected will be subject to a security investigation and may need to meet eligibility requirements for access to classified information.

Compensation

At Booz Allen, we celebrate your contributions, provide you with opportunities and choices, and support your total well-being. Our offerings include health, life, disability, financial, and retirement benefits, as well as paid leave, professional development, tuition assistance, work-life programs, and dependent care. Our recognition awards program acknowledges employees for exceptional performance and superior demonstration of our values. Full-time and part-time employees working at least 20 hours a week on a regular basis are eligible to participate in Booz Allen's benefit programs. Individuals that do not meet the threshold are only eligible for select offerings, not inclusive of health benefits. We encourage you to learn more about our total benefits by visiting the Resource page on our Careers site and reviewing Our Employee Benefits page.

Salary at Booz Allen is determined by various factors, including but not limited to location, the individual's particular combination of education, knowledge, skills, competencies, and experience, as well as contract-specific affordability and organizational requirements. The projected compensation range for this position is $61,900.00 to $141,000.00 (annualized USD). The estimate displayed represents the typical salary range for this position and is just one component of Booz Allen's total compensation package for employees. This posting will close within 90 days from the Posting Date.

Identity Statement

As part of the hiring process, we will ask you to complete an identity verification process that leverages advanced biometrics and artificial intelligence to ensure authenticity and protect against identity fraud. You are expected to be on camera during interviews and assessments. We reserve the right to take your picture to verify your identity and prevent fraud.

Candidate AI Usage Policy

AI is a part of our daily work at Booz Allen, and we are committed to the responsible and ethical use of AI tools. However, we want to ensure a fair candidate process based on your own skills and knowledge. As part of this commitment, the use of artificial intelligence (AI) or other tools to assist with responses during interviews (whether in-person or virtual) is prohibited unless permission is explicitly provided.

Work Model
Our people-first culture prioritizes the benefits of collaboration, whether it occurs in person or virtually. To support engagement and effective communication, employees working virtually are generally expected to have their cameras on during meetings.
  • Remote: If this position is listed as remote, there may still be occasions when you are required to work in person at a Booz Allen or customer facility.
  • Hybrid: If this position is listed as hybrid, you will be expected to work from a Booz Allen facility frequently, in alignment with leadership expectations and the needs of the role. You may also be required to work from or visit a customer facility.
  • Onsite: If this position is listed as onsite, work will primarily be performed at a Booz Allen office or customer facility, where employees will collaborate directly with colleagues and customers as required by the role.


Commitment to Non-Discrimination

All qualified applicants will receive consideration for employment without regard to disability, status as a protected veteran or any other status protected by applicable federal, state, local, or international law.

Not ready to apply? Join our Talent Community and sign up for job alerts.

What You'll Do

2+ years of experience in dynamic manufacturing and R&D environment evaluating new packaging materials, processes, and architectures to align to state-of-the-art
Experience in eCAD and mCAD software
Experience with packaging, PCB fabrication, cleanroom processing, or SMT assembly
Experience developing packaging solutions that optimize Size Weight and Power (SWaP) and prototyping designs in a high-mix, low-volume R&D environment
Experience operating and maintaining complex equipment in microelectronics rapid prototyping laboratories
Experience with the complete packaging assembly processes from concept to prototype, including equipment and material selection for panel-level, wafer-level, and chip-level systems

Skills & Technologies

Business Services & Consulting

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Booz Allen Hamilton
Business Services & Consulting
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