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Overview

Company
Metasys Technologies
Location
all cities, OH 36
Employment type
On-site
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Back to Jobs
M
Metasys TechnologiesVerified Employer

Business Services & Consulting • all cities, OH 36

CAD PCB Layout Engineer (Mixed-Signal, RF, High-Reliability) (36)

all cities, OH 36On-sitePosted 10 hours ago
Business Services & Consulting

About the Role

CAD PCB Layout Engineer (Mixed-Signal, RF, High-Reliability)
Naperville, IL (Onsite)
Perm Role

- Due to ITAR and/or CUI compliance, this position requires candidates to be US Citizens
Client is seeking a PCB Layout Engineer to support the development of mission-critical electronics for aerospace, defense, industrial, and medical applications. This role combines hands-on PCB design, including support across multiple CAD platforms.
WHAT YOU WILL BE DOING
  • Design and develop complex, multi-layer PCB layouts (rigid, rigid-flex, HDI)
  • Lead component placement, routing, and stack-up definition for mixed-signal and RF designs
  • Perform high-speed and RF routing, including controlled impedance and differential pairs
  • Apply best practices for:
    • Signal integrity (SI) and power integrity (PI)
    • EMI/Client mitigation and shielding
    • Thermal and grounding strategies
  • Generate fabrication and assembly documentation (Gerber/ODB++, drawings)
  • Conduct DFM/DFA/DFT reviews with manufacturers
  • Collaborate with EE, ME, and manufacturing teams
Leadership & Mentorship
  • Provide technical guidance and design reviews
  • Support CAD environments and workflows across multiple tools
  • Help define and maintain PCB libraries, standards, and best practices
WHAT IS NEEDED FOR THIS ROLE
  • Associate's degree in Electrical Engineering or equivalent experience
  • 2-5+ years of PCB layout experience in high-reliability industries
  • Strong proficiency in Altium Designer
  • Working knowledge of at least one additional PCB CAD tool, such as:
    • Cadence Allegro / OrCAD
    • Siemens Xpedition (Mentor Graphics)
  • Proven experience with:
    • Mixed-signal and RF PCB design
    • High-speed interfaces (DDR, PCIe, SERDES, etc.)
    • Multi-layer stack-Client (8+ layers)
  • Strong understanding of:
    • Controlled impedance routing
    • SI/PI fundamentals
    • EMI/Client design practices
Preferred Skills
  • Experience mentoring or supporting:
    • Cadence Allegro or
    • Siemens Xpedition (Mentor Graphics)
  • RF design in GHz frequency ranges
  • Rigid-flex and HDI technologies
CAD PCB Layout Engineer (Mixed-Signal, RF, High-Reliability)
Naperville, IL (Onsite)
Perm Role

- Due to ITAR and/or CUI compliance, this position requires candidates to be US Citizens
Client is seeking a PCB Layout Engineer to support the development of mission-critical electronics for aerospace, defense, industrial, and medical applications. This role combines hands-on PCB design, including support across multiple CAD platforms.
WHAT YOU WILL BE DOING
  • Design and develop complex, multi-layer PCB layouts (rigid, rigid-flex, HDI)
  • Lead component placement, routing, and stack-up definition for mixed-signal and RF designs
  • Perform high-speed and RF routing, including controlled impedance and differential pairs
  • Apply best practices for:
    • Signal integrity (SI) and power integrity (PI)
    • EMI/Client mitigation and shielding
    • Thermal and grounding strategies
  • Generate fabrication and assembly documentation (Gerber/ODB++, drawings)
  • Conduct DFM/DFA/DFT reviews with manufacturers
  • Collaborate with EE, ME, and manufacturing teams
Leadership & Mentorship
  • Provide technical guidance and design reviews
  • Support CAD environments and workflows across multiple tools
  • Help define and maintain PCB libraries, standards, and best practices
WHAT IS NEEDED FOR THIS ROLE
  • Associate's degree in Electrical Engineering or equivalent experience
  • 2-5+ years of PCB layout experience in high-reliability industries
  • Strong proficiency in Altium Designer
  • Working knowledge of at least one additional PCB CAD tool, such as:
    • Cadence Allegro / OrCAD
    • Siemens Xpedition (Mentor Graphics)
  • Proven experience with:
    • Mixed-signal and RF PCB design
    • High-speed interfaces (DDR, PCIe, SERDES, etc.)
    • Multi-layer stack-Client (8+ layers)
  • Strong understanding of:
    • Controlled impedance routing
    • SI/PI fundamentals
    • EMI/Client design practices
Preferred Skills
  • Experience mentoring or supporting:
    • Cadence Allegro or
    • Siemens Xpedition (Mentor Graphics)
  • RF design in GHz frequency ranges
  • Rigid-flex and HDI technologies

What You'll Do

Design and develop complex, multi-layer PCB layouts (rigid, rigid-flex, HDI)
Lead component placement, routing, and stack-up definition for mixed-signal and RF designs
Perform high-speed and RF routing, including controlled impedance and differential pairs
Apply best practices for: Signal integrity (SI) and power integrity (PI)
EMI/Client mitigation and shielding
Thermal and grounding strategies

Skills & Technologies

Business Services & Consulting

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