Business Services & Consulting • all cities, NC 28
Mechanical Engineering Technical Leader (28)
all cities, NC 28On-sitePosted 13 hours ago
Business Services & Consulting
About the Role
ASIC Mechanical Engineer
We are seeking a highly experienced and driven ASIC Mechanical Engineer to join the Cisco ASIC Group. In this role, you will lead mechanical and thermomechanical simulation efforts for ASICs and complex silicon/package/board assemblies, driving design decisions and ensuring product reliability for high-performance Cisco systems.
You will work across a globally distributed team and play a key role in shaping simulation methodologies, reliability strategies, and design guidelines across packaging, board-level integration, and system hardware engineering.
Your Impact
Lead and perform advanced finite element analysis (FEA) to evaluate thermomechanical behavior and reliability of ASIC packages and board-level assemblies, including stress, warpage, and interconnect integrity.
Own and drive solder joint reliability assessments, including thermal cycling, mechanical shock, and vibration, and develop lifetime prediction methodologies.
Model and analyze nonlinear and time-dependent material behavior, including creep, viscoplasticity, and fatigue, with strong understanding of temperature and rate effects.
Define and establish simulation methodologies, modeling best practices, and correlation strategies for packaging and board-level reliability.
Drive correlation between simulation and reliability testing (e.g., TCT, drop, field returns) to improve predictive accuracy and enable design signoff.
Influence product design by providing data-driven recommendations, risk assessments, and reliability sign-off criteria early in the development cycle.
Lead root cause analysis for mechanical/reliability failures and guide cross-functional teams toward robust solutions.
Develop and scale simulation workflows and automation using Python, Fortran, or similar tools to improve team efficiency and consistency.
Communicate complex technical findings clearly to stakeholders across mechanical, packaging, and system teams.
Minimum Qualifications
Bachelors + 8 years, or Masters + 6 years, or PhD + 3+ years in mechanical engineering or related field.
Strong experience in thermomechanical simulation of semiconductor packages and/or board-level assemblies.
Proven track record in solder joint reliability analysis, including fatigue and/or creep modeling.
Deep hands-on experience with ABAQUS or ANSYS, including nonlinear material modeling.
Demonstrated ability to drive technical decisions and work across global teams.
Preferred Qualifications
Expertise in board-level reliability (BLR) and PCB–package interaction modeling.
Professional with solder constitutive models (e.g., Anand) and fatigue life prediction methods (Coffin-Manson, Darveaux).
Knowledge of JEDEC/IPC standards for reliability qualification.
Experience with advanced packaging (flip chip, 2.5D/3D, heterogeneous integration).
Track record of correlating simulation with test data and driving design improvements.
ASIC Mechanical Engineer
We are seeking a highly experienced and driven ASIC Mechanical Engineer to join the Cisco ASIC Group. In this role, you will lead mechanical and thermomechanical simulation efforts for ASICs and complex silicon/package/board assemblies, driving design decisions and ensuring product reliability for high-performance Cisco systems.
You will work across a globally distributed team and play a key role in shaping simulation methodologies, reliability strategies, and design guidelines across packaging, board-level integration, and system hardware engineering.
Your Impact
Lead and perform advanced finite element analysis (FEA) to evaluate thermomechanical behavior and reliability of ASIC packages and board-level assemblies, including stress, warpage, and interconnect integrity.
Own and drive solder joint reliability assessments, including thermal cycling, mechanical shock, and vibration, and develop lifetime prediction methodologies.
Model and analyze nonlinear and time-dependent material behavior, including creep, viscoplasticity, and fatigue, with strong understanding of temperature and rate effects.
Define and establish simulation methodologies, modeling best practices, and correlation strategies for packaging and board-level reliability.
Drive correlation between simulation and reliability testing (e.g., TCT, drop, field returns) to improve predictive accuracy and enable design signoff.
Influence product design by providing data-driven recommendations, risk assessments, and reliability sign-off criteria early in the development cycle.
Lead root cause analysis for mechanical/reliability failures and guide cross-functional teams toward robust solutions.
Develop and scale simulation workflows and automation using Python, Fortran, or similar tools to improve team efficiency and consistency.
Communicate complex technical findings clearly to stakeholders across mechanical, packaging, and system teams.
Minimum Qualifications
Bachelors + 8 years, or Masters + 6 years, or PhD + 3+ years in mechanical engineering or related field.
Strong experience in thermomechanical simulation of semiconductor packages and/or board-level assemblies.
Proven track record in solder joint reliability analysis, including fatigue and/or creep modeling.
Deep hands-on experience with ABAQUS or ANSYS, including nonlinear material modeling.
Demonstrated ability to drive technical decisions and work across global teams.
Preferred Qualifications
Expertise in board-level reliability (BLR) and PCB–package interaction modeling.
Professional with solder constitutive models (e.g., Anand) and fatigue life prediction methods (Coffin-Manson, Darveaux).
Knowledge of JEDEC/IPC standards for reliability qualification.
Experience with advanced packaging (flip chip, 2.5D/3D, heterogeneous integration).
Track record of correlating simulation with test data and driving design improvements.
What You'll Do
Lead and perform advanced finite element analysis (FEA) to evaluate thermomechanical behavior and reliability of ASIC packages and board-level assemblies, including stress, warpage, and interconnect integrity.
Own and drive solder joint reliability assessments, including thermal cycling, mechanical shock, and vibration, and develop lifetime prediction methodologies.
Model and analyze nonlinear and time-dependent material behavior, including creep, viscoplasticity, and fatigue, with strong understanding of temperature and rate effects.
Define and establish simulation methodologies, modeling best practices, and correlation strategies for packaging and board-level reliability.
Drive correlation between simulation and reliability testing (e.g., TCT, drop, field returns) to improve predictive accuracy and enable design signoff.
Influence product design by providing data-driven recommendations, risk assessments, and reliability sign-off criteria early in the development cycle.
